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FUJITSU[Fujitsu Media Devices Limited]
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| Part No. |
DS_SCENIC_C620
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| OCR Text |
...geIT: software suites with best integration into your IT environment optionally available Security Easy and secure access and data protection for your business intelligence SecureIT: software suite with best integration into your IT environ... |
| Description |
SCENIC C620 Green PC Small Form Factor PC
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| File Size |
84.31K /
4 Page |
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it Online |
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Integrated Device Techn...
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| Part No. |
8SLVP1104I 8SLVP1104ANLGI 8SLVP1104ANLGI8 8SLVP1104I-18
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| OCR Text |
...2.88mhz sine wave, v pp = 1v, integration range : 1khz C 40mhz 170 fs f ref = 122.88mhz sine wave, v pp = 1v, integration range: 10khz C 20mhz 114 fs f ref = 122.88mhz sine wave, v pp = 1v, integration range: 12khz C 20mhz 114 fs... |
| Description |
LVPECL Output Fanout Buffer
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| File Size |
432.70K /
21 Page |
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it Online |
Download Datasheet |
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Integrated Device Techn...
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| Part No. |
8SLVP1102I 8SLVP1102I-18 8SLVP1102ANLGI 8SLVP1102ANLGI8
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| OCR Text |
...2.88mhz sine wave, v pp = 1v, integration range: 1khz C 40mhz 157 fs f ref = 122.88mhz sine wave, v pp = 1v, integration range: 10khz C 20mhz 92 fs f ref = 122.88mhz sine wave, v pp = 1v, integration range: 12khz C 20mhz 91 fs f r... |
| Description |
LVPECL Output Fanout Buffer
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| File Size |
434.28K /
21 Page |
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it Online |
Download Datasheet |
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意法半导
STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
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| Part No. |
EMIF03-SIM01 -EMIF03-SIM01
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| OCR Text |
...liability offered by monolithic integration High reducing of parasitic elements through integration & wafer level packaging.
COMPLIES WITH THE FOLLOWING STANDARDS : IEC61000-4-2 15kV (air discharge) 8 kV (contact discharge) on input & ou... |
| Description |
003 LINES EMI FILTER INCLUDING ESD PROTECTION
3 LINES EMI FILTER INCLUDING ESD PROTECTION
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| File Size |
158.27K /
11 Page |
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it Online |
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STATSCHIP[STATS ChipPAC, Ltd.]
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| Part No. |
FBGA-SD
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| OCR Text |
...ility enables device and signal integration to improve electrical performance and reduce overall package I/O requirements. Wafer thinning technology, overhang wire bond technology and the use of spacers between stacked die provide the flexi... |
| Description |
Fine Pitch Ball Grid Array - Stacked Die
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| File Size |
555.83K /
2 Page |
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it Online |
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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| Part No. |
GCU04AA-130
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| OCR Text |
...e current Current-squared, time integration Critical rate of rise of on-state current Critical rate of rise of reverse recovery current Peak forward gate power dissipation Peak reverse gate power dissipation Average forward gate power dissi... |
| Description |
HIGH POWER INVERTER USE PRESS PACK TYPE
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| File Size |
62.97K /
6 Page |
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it Online |
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http://
MITSUBISHI[Mitsubishi Electric Semiconductor]
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| Part No. |
GCU08BA-130
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| OCR Text |
...e current Current-squared, time integration Critical rate of rise of on-state current Critical rate of rise of reverse recovery current Peak forward gate power dissipation Peak reverse gate power dissipation Average forward gate power dissi... |
| Description |
MITSUBISHI GCT (Gate Commutated Turn-off) THYRISTOR UNIT
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| File Size |
60.32K /
6 Page |
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it Online |
Download Datasheet |
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Price and Availability
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