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  glass-encapsulated Datasheet PDF File

For glass-encapsulated Found Datasheets File :: 645    Search Time::2.656ms    
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    AD8018 AD8018AR AD8018AR-REEL AD8018ARU AD8018ARU-EVAL AD8018ARU-REEL

AD[Analog Devices]
Part No. AD8018 AD8018AR AD8018AR-REEL AD8018ARU AD8018ARU-EVAL AD8018ARU-REEL
OCR Text ...ed devices is determined by the glass transition temperature of the plastic, approximately 150C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package....
Description 5 V, Rail-to-Rail, High-Output Current, xDSL Line Drive Amplifier

File Size 337.51K  /  19 Page

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    BAV100 BAV101 BAV100_2 BAV103 BAV102 BAV103/T1 BAV102/T1

NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
Part No. BAV100 BAV101 BAV100_2 BAV103 BAV102 BAV103/T1 BAV102/T1
OCR Text ...RES * Small hermetically sealed glass SMD package * Switching speed: max. 50 ns * General application * Continuous reverse voltage: max. 50 ...encapsulated in small hermetically sealed glass SOD80C SMD packages. k a MAM061 Fig.1 Si...
Description General purpose diodes 0.25 A, 60 V, SILICON, SIGNAL DIODE
From old datasheet system
Single-channel HOTLink II™ Transceiver
12 Output Buffer for 2 DDR and 3 SRAM DIMMS

File Size 36.75K  /  8 Page

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    Philips
Part No. BFG21W BFG21W_3
OCR Text ...d-circuit board with PTFE fibre-glass dielectric (r = 6.15, tan = 0.0019); thickness 0.64 mm, copper cladding = 35 m. DESCRIPTION multilayer ceramic chip capacitor; note 1 multilayer ceramic chip capacitor; note 1 multilayer ceramic chip c...
Description UHF power transistor
From old datasheet system

File Size 84.00K  /  12 Page

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    PHILIPS[Philips Semiconductors]
Part No. BLV862
OCR Text ...ne side of the copper-clad PTFE-glass board (TLX8) from Taconic, the other side is unetched and serves as a ground plane. Earth connections from the component side to the ground plane are made by through metallization. Fig.9 Printed-circ...
Description UHF linear push-pull power transistor

File Size 88.67K  /  12 Page

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    PHILIPS[Philips Semiconductors]
Part No. BLV861
OCR Text ...ne side of the copper-clad PTFE-glass board (TLX8) from Taconic, the other side is unetched and serves as a ground plane. Earth connections from the component side to the ground plane are made by through metallization. Fig.8 Printed-circ...
Description UHF linear push-pull power transistor

File Size 128.62K  /  12 Page

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    AD8010 AD80102000 AD8010AR-16-REEL7 AD8010AR-REEL AD8010AR-REEL7 AD8010AN

Analog Devices
Part No. AD8010 AD80102000 AD8010AR-16-REEL7 AD8010AR-REEL AD8010AR-REEL7 AD8010AN
OCR Text ...ed devices is determined by the glass transition temperature of the plastic, approximately +150C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package...
Description Low Power, High Current Distribution Amplifier
200 mA Output Current High-Speed Amplifier
200 mA Output Current High Speed Amplifier

File Size 185.31K  /  12 Page

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    BAT86 BAT86_2 BAT8600 BAT86/A52A BAT86AMO

NXP Semiconductors N.V.
Philips Semiconductors
Part No. BAT86 BAT86_2 BAT8600 BAT86/A52A BAT86AMO
OCR Text ...ed * Hermetically-sealed leaded glass package. APPLICATIONS * Ultra high-speed switching * Voltage clamping * Protection circuits * Blocking...encapsulated in a hermetically-sealed subminiature SOD68 (DO-34) package. The diode is suitable for ...
Description 0.2 A, SILICON, SIGNAL DIODE, DO-34 HERMETIC SEALED, GLASS PACKAGE-2
From old datasheet system
Schottky barrier diode
KIT FOOT FOR 16-SOIC

File Size 52.74K  /  8 Page

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    DRF1402F

List of Unclassifed Manufacturers
ETC[ETC]
Part No. DRF1402F
OCR Text ...t @ f = 465MHz Test board : FR4 glass epoxy board, dielectric constant = 4.5, thickness = 0.8 mm Test condition : CW test, VCC = 4.8 V, ICQ = 5 mA, frequency = 465 MHz. Fig 8. Test Circuit Schematic Diagram @f = 465MHz www.tachyonics....
Description UHF POWER TRANSISTOR
From old datasheet system

File Size 320.93K  /  6 Page

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    V365-V06C

Electronic Theatre Controls, Inc.
ETC[ETC]
List of Unclassifed Manufacturers
Part No. V365-V06C
OCR Text ...ter resin and encapsulated into glass fibre reinforced PBT (polybutylene-terephtalate). Ambient temperature from -10C to +60C. Standard voltages 24V /50Hz. AC and 12-24 V DC. Voltage tolerance +10% -15% AC and +10% -5% DC. Electric plug con...
Description 3/2 - MICRO SOLENOID VALVE - Normally closed (N.C.) 3 / 2 -微型电磁阀-常闭(NC

File Size 54.14K  /  2 Page

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    AD8152 AD8152JBP AD8152-EVAL

AD[Analog Devices]
Part No. AD8152 AD8152JBP AD8152-EVAL
OCR Text ...ed devices is determined by the glass transition temperature of the plastic, approximately 150C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the packa...
Description From old datasheet system
34 x 34, 3.2 Gbps Asynchronous Digital Crosspoint Switch

File Size 1,189.31K  /  32 Page

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For glass-encapsulated Found Datasheets File :: 645    Search Time::2.656ms    
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