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Rochester Electronics LLC |
Part No. |
54ACT11240JT/B
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Description |
54ACT11240 - Octal Buffers/Drivers
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Tech specs |
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Official Product Page
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Rochester Electronics LLC |
Part No. |
54ACT11245JT/B
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Description |
54ACT11245 - Bus Transceiver
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Tech specs |
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Official Product Page
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Molex, Inc.
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Part No. |
70287-1023 70287-1002 70287-1021 70287-1022 70287-1225 70287-1124
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Description |
CGrid Bkwy Hdr DR RtPn Tin 50Ckt 50 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER CGrid Bkwy Hdr DR RtPn Tin 8Ckt 8 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER CGrid Bkwy Hdr DR RtPn Tin 46Ckt 46 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER CGrid Bkwy Hdr DR RtPn Tin 48Ckt 48 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER CGrid Bkwy Hdr DR RtPn 30''SAu 62Ckt 62 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER CGrid Bkwy Hdr DR RtPn 15''SAu 56Ckt 56 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
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File Size |
235.77K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
92090-130LF
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Description |
Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10065490-130TRLF
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Description |
Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
90130-1226 0901301226
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68690-130HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
90130-1224 0901301224
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
78290-130HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
90130-1222 0901301222
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
L17H2990130
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Description |
Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
90130-1220 0901301220
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 20 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 20 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
69190-130HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
90130-1208 0901301208
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54112-409241000LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
90130-1206 0901301206
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54112-112400900LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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