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  90130-1124 Datasheet PDF File

For 90130-1124 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    PowerDynamics, Inc
Part No. 42R33-1124 42R33-1222 42R33-1121 42R33-1122 42R33-1X2X 42R33-1221 42R33-1224
Description IEC 60320 SINGLE FUSE HOLDER APPL. INLET; SOLDER TERMINALS; SIDE FLANGE

File Size 29.92K  /  1 Page

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Rochester Electronics LLC

Part No. 54ACT11240JT/B
Description 54ACT11240 - Octal Buffers/Drivers
Tech specs    

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HUA FENG CIRCUIT





    PowerDynamics, Inc
Part No. 42R01-1121 42R01-1122 42R01-1224 42R01-1221 42R01-1124 42R01-1222 42R01-1X2X
Description IEC 60320 C14 APPL. INLET; SCREW TERMINALS; SIDE FLANGE, PANEL MOUNT

File Size 36.88K  /  1 Page

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Rochester Electronics LLC

Part No. 54ACT11245JT/B
Description 54ACT11245 - Bus Transceiver
Tech specs    

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    Molex, Inc.
Part No. 70287-1023 70287-1002 70287-1021 70287-1022 70287-1225 70287-1124
Description CGrid Bkwy Hdr DR RtPn Tin 50Ckt 50 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid Bkwy Hdr DR RtPn Tin 8Ckt 8 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid Bkwy Hdr DR RtPn Tin 46Ckt 46 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid Bkwy Hdr DR RtPn Tin 48Ckt 48 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid Bkwy Hdr DR RtPn 30&apos;&apos;SAu 62Ckt 62 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid Bkwy Hdr DR RtPn 15&apos;&apos;SAu 56Ckt 56 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 235.77K  /  5 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

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    0901303310 90130-3310

Molex Electronics Ltd.
Part No. 0901303310 90130-3310
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 10 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    90130-1226 0901301226

Molex Electronics Ltd.
Part No. 90130-1226 0901301226
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

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    90130-1224 0901301224

Molex Electronics Ltd.
Part No. 90130-1224 0901301224
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    90130-1222 0901301222

Molex Electronics Ltd.
Part No. 90130-1222 0901301222
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    90130-1220 0901301220

Molex Electronics Ltd.
Part No. 90130-1220 0901301220
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 20 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 20 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-1208 0901301208

Molex Electronics Ltd.
Part No. 90130-1208 0901301208
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 54112-409241000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-1206 0901301206

Molex Electronics Ltd.
Part No. 90130-1206 0901301206
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 54112-112400900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 90130-1124 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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