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  87758-0816 Datasheet PDF File

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    87758-5017 0877585017

Molex Electronics Ltd.
Part No. 87758-5017 0877585017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
   2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 10121506-320816ALF
Description HPCE STD VT Receptacle 40P16S
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0877584416

Molex Electronics Ltd.
Part No. 0877584416
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 44 Circuits

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-108081650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580650 87758-0650

Molex Electronics Ltd.
Part No. 0877580650 87758-0650
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.64K  /  4 Page

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Amphenol Communications Solutions

Part No. 54202-T0816LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877581216 87758-1216

Molex Electronics Ltd.
Part No. 0877581216 87758-1216
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 57102-F08-16LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 32 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    0877582850

Molex Electronics Ltd.
Part No. 0877582850
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
MOLEX Connector

File Size 135.97K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-081602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs    

Official Product Page

    0877581017 87758-1017

Molex Electronics Ltd.
Part No. 0877581017 87758-1017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 10 Circuits
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 10 Circuits

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 54101-S08-16
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0877581016

Molex Electronics Ltd.
Part No. 0877581016
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 10 Circuits

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 57102-G08-16
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 32 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    0877580616 87758-0616

Molex Electronics Ltd.
Part No. 0877580616 87758-0616
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-808161050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580217 87758-0217

Molex Electronics Ltd.
Part No. 0877580217 87758-0217
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 2 Circuits, 0.76um (30u) Gold (Au) Selective Plating

File Size 170.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-408161800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877580216 87758-0216

Molex Electronics Ltd.
Part No. 0877580216 87758-0216
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 2 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.69K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-108161400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 87758-0816 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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