| |
|
 |
Amphenol Communications Solutions |
| Part No. |
68002-425HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68422-425HLF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 25 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77311-824-25LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0872632893 87263-2893
|
| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Receptacle, Surface Mount, Bottom Entry, 0.38μm (15μ) Gold (Au) Selective, 28 Circuits, with Pick-and-Place Cap
2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Bottom Entry, 0.38μm (15μ) Gold (Au) Selective, 28 Circuits, with Pick-and-Place Cap
|
| File Size |
355.59K /
5 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77315-124-25LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 25 Positions 2.54 mm (0.100in) Pitch, Right Angle
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
93992-425HLF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0872631823 87263-1823
|
| Description |
1.00mm (.039") Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filledBlack Housing, Phosphor Bronze, 0.38渭m (15渭") Gold (Au) Plating, with Plastic P
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filledBlack Housing, Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating, with Plastic Pegs,
|
| File Size |
355.99K /
5 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
61124-250CACLF
|
| Description |
Assembly, Top Mount, D/D(136Pins), VTB, Type 123, 3.3V, 5mm s/o, Right Push Rod Eject, 9.5mm Eject Travel
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54122-811242500LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54242-504140950LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
59112-G24-25-051LF
|
| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
54242-511061900LF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Stacking Header, Surface Mount, Double row, 6 Positions, 2.54mm (0.100in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
