2808 pdf Datasheet P11 Part Num --- IC-ON-LINE


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2808 Datasheet PDF File

For 2808 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

					SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4S280832A K4S280832A-TC_L10 K4S280832A-TC_L80 K4S280832A-TC_L1H K4S280832A-TC_L1L K4S280832A-TC_L75 K4S280832A-TC/L10 K4S280832A-TC/L1H K4S280832A-TC/L1L K4S280832A-TC/L75 K4S280832A-TC/L80
Description	128Mbit SDRAM 4M x 8Bit x 4 Banks Synchronous DRAM LVTTL
File Size	107.61K / 10 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54242-808081200LF
Description	BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 8 Positions
Tech specs				Official Product Page

HUA FENG CIRCUIT

					SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K9F2808U0A-YCB0 K9F2808U0A-YIB0
Description	Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVPS00; No. of Contacts:11; Connector Shell Size:21; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight TV 79C 79#22D PIN RECP
File Size	356.97K / 26 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54242-808081350LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd.
Part No.	K9F2808U0M-YIB0 K9F2808U0M-YCB0
Description	16M x 8 Bit NAND Flash Memory 1,600 × 8位NAND闪存
File Size	349.99K / 26 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77315-128-08LF
Description	BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page


Part No.	K4H280838C-TCB3 K4H280838C-TLB0
Description	16M X 8 DDR DRAM, 0.7 ns, PDSO66 16M X 8 DDR DRAM, 0.75 ns, PDSO66
File Size	344.67K / 54 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-808100950LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page


Part No.	K9F2808U0B-YIB00
Description	16M X 8 FLASH 2.7V PROM, 35 ns, PDSO48
File Size	510.77K / 30 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-808641400LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9F2808U0 K9F2808U0A K9F2808U0A- K9F2808U0A-YCB0 K9F2808U0A-YIB0
Description	16M x 8 Bit NAND Flash Memory
File Size	351.20K / 26 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59202-F28-08U050
Description	Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs				Official Product Page


Part No.	K9F2808U0C-DIB0 K9F2808U0C-YCB0
Description	16M X 8 FLASH 2.7V PROM, PBGA63 16M X 8 FLASH 2.7V PROM, 30 ns, PDSO48
File Size	798.66K / 33 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	59132-T28-08-037LF
Description	Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions, 2.00mm (0.079in) Pitch
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9F2808U0M- K9F2808U0M-YCB0 K9F2808U0M-YIB0
Description	16M x 8 Bit NAND Flash Memory
File Size	344.24K / 26 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54242-808161450LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Projects Unlimited, Inc.
Part No.	ASE02808MR-LW150-R
Description	RELEASED FROM ENGINEERING
File Size	265.34K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54242-808202350LF
Description	BERGSTIK STACKING
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor] SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4S280832C K4S280832C-TC_L75 K4S280832C-TC_L1H K4S280832C-TC_L1L K4S280832C-TC/L1H K4S280832C-TC/L1L K4S280832C-TC/L75 K4S280832C-TL750
Description	16M X 8 SYNCHRONOUS DRAM, 5.4 ns, PDSO54 4MB x 8Bit x 4 Banks Synchronous DRAM Data Sheet 128Mbit SDRAM 4M x 8Bit x 4 Banks Synchronous DRAM LVTTL
File Size	111.80K / 11 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54242-808201650LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

For 2808 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

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