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  001580-1163 Datasheet PDF File

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    0015800081-17

Molex Electronics Ltd.
Part No. 0015800081-17
Description 2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
File Size 24.68K  /  2 Page

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Amphenol Communications Solutions
Part No. 54122-116322000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0015800083-17

Molex Electronics Ltd.
Part No. 0015800083-17
Description 2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
File Size 24.47K  /  2 Page

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Amphenol Communications Solutions
Part No. 10145891-1631J13LF
Description DDR4 DIMM, Storage and Server Connector, Vertical, Surface Mount, 288 Position, 0.85mm (0.033in) Pitch
Tech specs 　 　

Official Product Page

    0015800085-17

Molex Electronics Ltd.
Part No. 0015800085-17
Description 2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical
File Size 24.72K  /  2 Page

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Amphenol Communications Solutions
Part No. 74741-163LF
Description 5 Row Signal Header, Straight, STB, Wide body, 1 Mod
Tech specs 　 　

Official Product Page

    0015800503

Molex Electronics Ltd.
Part No. 0015800503
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions
Part No. GSB3116342HR
Description USB 3.2, Type A, Receptacle, Upright Reverse, 9 Pins, Shell Kink with Nickel Plating, 30u\\ Gold, Dip 2.4mm, Blue High Temperature Housing, Tray Packaging
Tech specs 　 　

Official Product Page

    15-80-0323 0015800323

Molex Electronics Ltd.
Part No. 15-80-0323 0015800323
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size 1,218.30K  /  7 Page

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Amphenol Communications Solutions
Part No. RJE724881163
Description Modular Jack - High Performance, Input Output Connectors 8P8C, Shield, With LEDs.
Tech specs 　 　

Official Product Page

    0015800223

Molex Electronics Ltd.
Part No. 0015800223
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating,
File Size 1,218.21K  /  7 Page

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Amphenol Communications Solutions
Part No. 10106116-3006001LF
Description PwrBlade+® , Power Connectors, 3ACP+24S STB, Right Angle, Header.
Tech specs 　 　

Official Product Page

    0015800225

Molex Electronics Ltd.
Part No. 0015800225
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions
Part No. 54112-116342000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    15-80-0545 0015800545

Molex Electronics Ltd.
Part No. 15-80-0545 0015800545
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits
File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions
Part No. 54122-116302000RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 30 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    0015800243

Molex Electronics Ltd.
Part No. 0015800243
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits
File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions
Part No. GSB3116346FHR
Description USB 3.2, Type A, Receptacle, Upright Reverse, 9 Pins, Shell Kink with Nickel Plating, 30u\\ Gold, Dip 4.4mm, Blue High Temperature Housing, Tray Packaging
Tech specs 　 　

Official Product Page

    0015800245

Molex Electronics Ltd.
Part No. 0015800245
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 1,218.30K  /  7 Page

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Amphenol Communications Solutions
Part No. RJE7B1881163
Description Modular Jack - High Performance, Input Output Connectors 8P8C, CAT 6A, RA, Shield, with LEDs.
Tech specs 　 　

Official Product Page

For 001580-1163 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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