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DIODES[Diodes Incorporated]
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Part No. |
DMMT55511 DMMT5551S-7-F DMMT5551 DMMT5551-7-F DMMT5551S
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OCR Text |
...e Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30436 Rev. 7 - 2
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Description |
MATCHED NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
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File Size |
91.65K /
4 Page |
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it Online |
Download Datasheet |
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意法半导 STMICROELECTRONICS[STMicroelectronics]
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Part No. |
L6701TR L6701
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OCR Text |
...he increasing current demand of newer microprocessors and the modern high-current DC/DC converters and POLs requirements. It allows distributing equally load and power between the phases using smaller, cheaper and most common external power... |
Description |
3 Phase Controller for VR10, VR9 and K8 CPUs
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File Size |
489.15K /
44 Page |
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it Online |
Download Datasheet |
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DIODES[Diodes Incorporated]
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Part No. |
SD103ASDM-7-F SD103ASDM_1 SD103ASDM
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OCR Text |
...te Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants
DS30294 Rev. 7 - 2
1... |
Description |
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY
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File Size |
70.75K /
3 Page |
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it Online |
Download Datasheet |
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DIODES[Diodes Incorporated]
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Part No. |
SDM10M45SD1 SDM10M45SD-7-F SDM10M45SD
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OCR Text |
...te Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30386 Rev. 4 - 2
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Description |
SURFACE MOUNT SCHOTTKY BARRIER DIODE
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File Size |
72.36K /
3 Page |
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it Online |
Download Datasheet |
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DIODES[Diodes Incorporated]
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Part No. |
2N7002W-7-F 2N7002W_1 2N7002W 2N7002W1
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OCR Text |
...te Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30099 Rev. 9 - 2
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Description |
N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
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File Size |
68.84K /
3 Page |
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it Online |
Download Datasheet |
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DIODES[Diodes Incorporated]
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Part No. |
BSS84W-7-F BSS84W_1 BSS84W
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OCR Text |
...e Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30205 Rev. 9 - 2
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Description |
P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
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File Size |
91.40K /
4 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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