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				M/A-COM Technology Solutions, Inc. M/A-COM Technology Solu...
Part No.	PACKAGEDPINDIODES PACKAGEDPINDIODES-15
OCR Text	...ime 3 s i-region width mils ma4ph235-1072t 35 1.2 0.50 1.0 ? 0.3 0.4 ma4ph236-1072t 600 0.5 3.0 1.0 ? 1.5 2.0 ma4ph237-1079t 200 1.5 0.6@50ma 2.0 ? 3.0 3.0 ma4ph238-1072t 200 0.5 6. 0 1.0 0.30-0.60 2.0 ...
Description	Packaged PIN Diodes
File Size	380.88K / 7 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CP635
OCR Text	...ted mesa die size 106 x 106 mils die thickness 12 mils base bonding pad area 25 x 33 mils emitter bonding pad area 30 x 36 mils top side metalization al - 50,000? back side metalization ag - 10,000? backside collecto...
Description	Power Transistor PNP - High Current Transistor Chip
File Size	97.06K / 1 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC634
OCR Text	... minimal length of 0.31 mm (12 mils). gain: 22 db p1db: +23 dbm output ip3: +31 dbm saturated power: 24 dbm @ 23% pae supply voltage: +5 v @ 180 ma 50 ohm matched input/output die size: 2.07 x 0.97 x 0.10 mm electrical specifi cations, t...
Description	GaAs PHEMT MMIC DRIVER AMPLIFIER, 5 - 20 GHz
File Size	288.86K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC633
OCR Text	...h minimal length of 0.31 mm (12 mils). g ain: 29 d b p 1d b : +23 d b m o utput ip 3: +30 d b m s aturated p ower: +24 d b m @ 27% p a e s upply v oltage: +5 v @ 180 ma 50 o hm m atched i nput/ o utput d ie s ize: 2.07 x 0.93 x 0.1...
Description	GaAs PHEMT MMIC DRIVER AMPLIFIER, 5 - 17 GHz
File Size	335.84K / 8 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CZR1-04C CMR1-02 CXR1-04 CPD69 CMR1-02M
OCR Text	...d mesa die size 42.5 x 42.5 mils die thickness 12.5 mils anode bonding pad area 32 x 32 mils top side metalization ni/au - 5,000?/2,000? back side metalization ni/au - 5,000?/2,000? www.centralsemi.com r5 (5-april 2011) ...
Description	1 Amp Glass Passivated Rectifier Chip
File Size	398.72K / 2 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	MBR0540
OCR Text	...55 (1.400) 0.91 mm 1.2 2 mm 48 mils 2.36 mm 93 mils 0.91 mm 4.19 mm 165 mils SOD-123 LAND PADS 0.112 (2.850) 0.100 (2.550) SOD123 Mark: B4 0.154 (3.900) 0.142 (3.600) 0.046 (3.900) 0.035 (3.600) 0.071 (1.800) 0.055 (1.400) ...
Description	1.0 Ampere Schottky Power Rectifiers
File Size	178.99K / 6 Page	View it Online	Download Datasheet

				Central Semiconductor Corp Central Semiconductor C...
Part No.	CBCX68 MPS650 MPS651
OCR Text	...ial planar die size 40 x 40 mils die thickness 7.1 mils base bonding pad area 7.9 x 8.7 mils emitter bonding pad area 9.0 x 14 mils top side metalization al - 30,000? back side metalization au-as - 13,000? www.centra...
Description	NPN - High Current Transistor Chip
File Size	456.53K / 2 Page	View it Online	Download Datasheet

				AVAGO TECHNOLOGIES LIMITED
Part No.	HCNW136-300E
OCR Text	... lead protrusion is 0.25 mm (10 mils) max. 3.56 0.13 (0.140 0.005) package outline drawings 8-pin dip package (6n135/6, hcpl-2502) 8-pin dip package with gull wing surface mount option 300 (6n135/6) 0.635 0.25 (0.025 0.010) 12 nom. 9....
Description	Single Channel, High Speed Optocouplers
File Size	358.98K / 16 Page	View it Online	Download Datasheet

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