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MAXIM[Maxim Integrated Products]
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Part No. |
MAX2055EVKIT MAX2055_1 MAX2055 MAX20551
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OCR Text |
.... The MAX2055 EV kit uses eight evenly spaced, 0.016in-diameter, plated through holes to connect the EP to the lower ground planes. Depending on the RF ground plane spacing, large surface-mount pads in the RF path may need to have the groun... |
Description |
Evaluation Kit for the MAX2055
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File Size |
266.41K /
7 Page |
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it Online |
Download Datasheet
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NXP Semiconductors N.V. ANALOGICTECH[Advanced Analogic Technologies] PHILIPS[Philips Semiconductors]
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Part No. |
BGF802-20 BGF802-20_4
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OCR Text |
...age. PROCEDURE 1. Apply a thin, evenly spread layer of thermal compound to the module flange bottom surface. Excessive use of thermal compound may result in increased thermal resistance and possible bending of the of the flange. Too little ... |
Description |
CDMA800 power module From old datasheet system
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File Size |
89.84K /
12 Page |
View
it Online |
Download Datasheet
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MAXIM[Maxim Integrated Products]
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Part No. |
MAX2056EVKIT MAX2056_1 MAX2056
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OCR Text |
...P. The MAX2056 EV kit uses nine evenly spaced, 0.016in-diameter, plated through holes to connect the EP to the lower ground planes.
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MAX2056 E... |
Description |
From old datasheet system Evaluation Kit for the MAX2056
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File Size |
243.15K /
6 Page |
View
it Online |
Download Datasheet
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Price and Availability
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