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Amphenol Communications Solutions |
| Part No. |
54101-T10-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Coilcraft lnc. Coilcraft, Inc. COILCRAFT INC
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| Part No. |
0805HS-820TL 0805HS-120TJL 0805HS-121TL 0805HS-330TL 0805HS-181TL 0805HS-180TJL 0805HS-220TL 0805HS-101TL 0805HS-151TL 0805HS-221TL 0805HS-030TJL 0805HS-060TJL 0805HS-080TJL 0805HS-100TJL 0805HS-150TJL 0805HS-470TL 0805HS-560TL 0805HS-390TL 0805HS-100TJLC 0805HS-150TJLB 0805HS-181TJLB 0805HS-151TJLC 0805HS-330TJLB 0805HS-820TJLB
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| Description |
Chip Inductors RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.01 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.15 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD RF inductor, ceramic core, 5% tol, SMT, RoHS 1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
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| File Size |
197.06K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54101-T30-08
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 8 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
55101-T1109LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10018783-00101TLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x4, 64 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54101-T30-00
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 0 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54101-T06-00
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 0 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
55101-T1108LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10069690-10101TLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle Mount, x4, 64 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54101-T06-07LF
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| Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Through Hole, Single Row, 7 Positions
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| Tech specs |
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Official Product Page
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Advanced Monolythic Ceramics, Inc.
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| Part No. |
101T43W224KP6E 201T43W154KP6 201T43W154MP6 201T43W154KP6E 101T43W224MP6
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| Description |
CAPACITOR, CERAMIC, MULTILAYER, 100 V, X7R, 0.22 uF, SURFACE MOUNT, 1812 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, X7R, 0.15 uF, SURFACE MOUNT, 1812 CHIP
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| File Size |
206.50K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54101-T1102LF
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| Description |
BERGSTIK 0.100,TH HEADER-TIN
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| Tech specs |
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Official Product Page
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| Part: DS2482X-101+T |
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