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Spansion, Inc.
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| Part No. |
S75PL127NBFJFWGZ2 S75PL127NCFJFWGZ3 S75PL256NCFJFWGZ3 S75PL127NCFJFWGZ2 S75PL127NCFJFWGZ0 S75PL256NCFJFWGZ2
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| OCR Text |
...ll placement a3,a4,a5,a6,a7,a8, depopulated solder balls b1,m3,m4,m5,m6,m7,m8 notes: 1. dimensioning and tolerancing methods per asme y14.5m-1994. 2. all dimensions are in millimeters. 3. ball position designation per jep95, section 4.3, s... |
| Description |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
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| File Size |
164.78K /
8 Page |
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