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  87052-758 Datasheet PDF File

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Part No. 7586 7521 7578
Description 1.5A LOW VOLTAGE LDO, -40C to 125C, 8-DFN, TUBE
Low Quiescent Current LDO, -40C to 125C, 3-SOT-23, T/R
500MA CMOS LDO, -40C to 125C, 8-SOIC 150mil, T/R

File Size 157.58K  /  1 Page

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Amphenol Communications Solutions

Part No. 87052-106HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 6 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87758-3417

Molex Electronics Ltd.
Part No. 87758-3417
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 87052-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    87758-3616

Molex Electronics Ltd.
Part No. 87758-3616
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 36 Circuits

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 87052-150HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    87758-3816

Molex Electronics Ltd.
Part No. 87758-3816
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 87052-170HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    75861-0504

Molex Electronics Ltd.
Part No. 75861-0504
Description 1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX? Backplane L-Series Connector System, Open Header, 25 Circuits

File Size 151.43K  /  3 Page

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Amphenol Communications Solutions

Part No. 87052-418HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    47589-0001

Molex Electronics Ltd.
Part No. 47589-0001
Description 0.65mm (.026) Pitch Micro-USB AB Receptacle, Right Angle, Bottom Mount, SMT, Lead Free

File Size 133.48K  /  3 Page

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Amphenol Communications Solutions

Part No. 87052-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    87758-2417

Molex Electronics Ltd.
Part No. 87758-2417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 87052-458HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    87758-2416

Molex Electronics Ltd.
Part No. 87758-2416
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits, 0.38μm 15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 87052-110HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 10 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    87758-1850

Molex Electronics Ltd.
Part No. 87758-1850
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits

File Size 135.97K  /  4 Page

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Amphenol Communications Solutions

Part No. 87052-134HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    75861-0103

Molex Electronics Ltd.
Part No. 75861-0103
Description 1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX? Backplane L-Series Connector System, Open Header, 55 Circuits, Gold (Au) 0.76μm (30μ)

File Size 154.40K  /  3 Page

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Amphenol Communications Solutions

Part No. 87052-154HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

For 87052-758 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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