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  6083 Datasheet PDF File

For 6083 Found Datasheets File :: 146+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K

SAMSUNG[Samsung semiconductor]
Part No. K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K4H561638H K4H560838H-UC_LCC K4H560838H K4H560838H-UC_LA2 K4H560838H-UC_LB0 K4H560838H-UC_LB3
Description 256Mb H-die DDR SDRAM Specification
File Size 356.30K  /  24 Page

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Amphenol Communications Solutions
Part No. G832MC030608322HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 18.7 mm, 60 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold White.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II 256Mb的电子芯片内存规4pin sTSOP -
File Size 180.64K  /  13 Page

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Amphenol Communications Solutions
Part No. G832MC010608322HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 18.7 mm, 60 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold Black.
Tech specs 　 　

Official Product Page

    K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3

Samsung semiconductor
Part No. K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3
Description 256Mb J-die DDR SDRAM Specification
File Size 352.76K  /  24 Page

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Amphenol Communications Solutions
Part No. 75160-839-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60
Description 256Mb E-die SDRAM Specification 256Mb的电子芯片内存规
File Size 194.54K  /  14 Page

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Amphenol Communications Solutions
Part No. 10137926-0831LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 8 Positions, GW Compatible LCP, Tape and Reel with cap.
Tech specs 　 　

Official Product Page

    K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL75 K4S560432E-TC75 K4S560432E-TC
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II
File Size 196.59K  /  14 Page

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Amphenol Communications Solutions
Part No. 10137926-0832LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 8 Positions, Non GW Compatible LCP, Tape and Reel with cap.
Tech specs 　 　

Official Product Page

    K4S561632E-UC75 K4S561632E-UL75 K4S561632E-UL60 K4S561632E-UC60 K4S560832E-UC75 K4S560832E-UL75 K4S560432E-UC K4S560432E

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S561632E-UC75 K4S561632E-UL75 K4S561632E-UL60 K4S561632E-UC60 K4S560832E-UC75 K4S560832E-UL75 K4S560432E-UC K4S560432E-UC75 K4S560432E-UL75
Description 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 256Mb的电子芯片与内存规格4 TSOP-II免费（符合RoHS
File Size 196.27K  /  14 Page

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Amphenol Communications Solutions
Part No. 10136656-0832NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75
Description 16M x 16 SDRAM, LVTTL, 133MHz
256Mb E-die SDRAM Specification 54pin sTSOP-II
File Size 205.22K  /  14 Page

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Amphenol Communications Solutions
Part No. 75160-835-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,16 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    http://
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560438D-GCA2 K4H561638D-GLB3 K4H560838D-GLB3 K4H561638D-GCA2 K4H561638D-GLB0 K4H560438D-GLB0 K4H560438D-GLB3 K4H560838D-GLB0 K4H560838D-GCB3 K4H560838D-GCA2 K4H561638D-GLA2
Description DIODE ZENER SINGLE 200mW 33Vz 0.05mA-Izt 0.05 0.05uA-Ir 25 SOD-323 3K/REEL 的DDR 256Mb
DIODE ZENER SINGLE 500mW 28Vz 0.05mA-Izt 0.05 0.05uA-Ir 21.2 SOD-123 3K/REEL 的DDR 256Mb
DIODE ZENER SINGLE 200mW 30Vz 0.05mA-Izt 0.05 0.05uA-Ir 22.8 SOD-323 3K/REEL 的DDR 256Mb
DIODE ZENER SINGLE 500mW 36Vz 0.05mA-Izt 0.05 0.05uA-Ir 27.3 SOD-123 3K/REEL 的DDR 256Mb
DIODE ZENER SINGLE 150mW 36Vz 0.05mA-Izt 0.05 0.05uA-Ir 27.3 SOD-523 3K/REEL 的DDR 256Mb
DIODE ZENER SINGLE 150mW 33Vz 0.05mA-Izt 0.05 0.05uA-Ir 25 SOD-523 3K/REEL 的DDR 256Mb
DIODE ZENER SINGLE 200mW 36Vz 0.05mA-Izt 0.05 0.05uA-Ir 27.3 SOD-323 3K/REEL
DIODE ZENER SINGLE 200mW 28Vz 0.05mA-Izt 0.05 0.05uA-Ir 21.2 SOD-323 3K/REEL
DIODE ZENER SINGLE 500mW 39Vz 0.05mA-Izt 0.05 0.05uA-Ir 29.6 SOD-123 3K/REEL
DIODE ZENER SINGLE 200mW 39Vz 0.05mA-Izt 0.05 0.05uA-Ir 29.6 SOD-323 3K/REEL
File Size 293.31K  /  26 Page

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Amphenol Communications Solutions
Part No. 75160-839-15LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,15 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    K4H561638D-TC_LB0 K4H560838D-TC_LA0 K4H560838D-TC_LA2 K4H560838D-TC_LB3 K4H560838D-TC_LB0 K4H561638D-TC_LA0 K4H561638D-T

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H561638D-TC_LB0 K4H560838D-TC_LA0 K4H560838D-TC_LA2 K4H560838D-TC_LB3 K4H560838D-TC_LB0 K4H561638D-TC_LA0 K4H561638D-TC_LA2 K4H561638D-TC_LB3 K4H560438D-TC_LB3 K4H560438D-TC K4H560438D-TC_LA0 K4H560438D-TC_LA2 K4H560438D-TC_LB0 K4H561638D-TC/LA2 K4H561638D-TC/LB0 K4H561638D-TC/LA0 K4H561638D-TC/LB3
Description 256MB
File Size 233.83K  /  25 Page

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Amphenol Communications Solutions
Part No. 10136656-0832LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    K4H560838H-UC/LCC K4H561638H-UC/LCC K4H560438H-UC/LA2 K4H560838H-UC/LA2 K4H561638H-UC/LA2 K4H560438H-UC/LB0 K4H561638H-U

Atmel, Corp.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560838H-UC/LCC K4H561638H-UC/LCC K4H560438H-UC/LA2 K4H560838H-UC/LA2 K4H561638H-UC/LA2 K4H560438H-UC/LB0 K4H561638H-UC/LB0 K4H560838H-UC/LB3 K4H561638H-UC/LB3 K4H560838H-UC/LB0 K4H560438H-UCA20 K4H560838H-UCA20 K4H560838H-UCB30
Description 32M X 8 DDR DRAM, 0.7 ns, PDSO66 ROHS COMPLIANT, TSOP2-66
32M X 8 DDR DRAM, 0.75 ns, PDSO66 ROHS COMPLIANT, TSOP2-66
64M X 4 DDR DRAM, 0.75 ns, PDSO66 ROHS COMPLIANT, TSOP2-66
256Mb H-die DDR SDRAM Specification
File Size 361.04K  /  24 Page

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Amphenol Communications Solutions
Part No. RJHSE6083
Description Modular Jack - 8P8C, Vertical, Single Port, With Panel Stops, No Shield, With LEDs
Tech specs 　 　

Official Product Page

For 6083 Found Datasheets File :: 146+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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