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Amphenol Communications Solutions |
Part No. |
68655-434HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail.
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Tech specs |
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Official Product Page
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Micropac Industries, Inc. MICROPAC[Micropac Industries]
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Part No. |
42142
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Description |
RADIATION TOLERANT POWER OPERATIONAL AMPLIFIER OP-AMP, 200 uV OFFSET-MAX, 1 MHz BAND WIDTH, MDMA8
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File Size |
195.93K /
8 Page |
View
it Online |
Download Datasheet
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Price and Availability
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